Infineon marks innovation milestone with 300mm power silicon carbide wafer
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Story details from Hacker News ↗ · linked article on infineon.com.
Infineon marks innovation milestone with 300mm power silicon carbide wafer was first seen on Hacker News · Front page on Nov 9, 2026. Since then it has appeared in 77 checks on 2 different days. Its best position was #13 of 30, reached on Nov 10, 05:54 UTC. It dropped off the list after Nov 10, 13:54 UTC.
Position on Hacker News · Front page at every check (lower is better).
Best rank per day (UTC).
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The summary at the top of that page is: Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer PBusiness & Financial Press Nov 09, 2026 Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers Technological…
What surprises me with Infineon is that they seem to not work on a LLM on a chip. In particular that here in Linz Infineon, Apple's 5G modem designer and the Johannes Kepler University with Sepp Hochreiter (Inventor of LSTM) are just next to each other. I watched a interview of Infineon head of AI just recently, and…
Anyone know why it took so long for them to transition to 300mm? As mentioned in the article, they're mainly using existing 300mm equipment designed for silicon, which transitioned years ago. I imagine some process steps are different (mainly growing to larger boule, but probably others), but it doesn't seem like…
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Not at the moment. It was last on the list on Nov 10, 13:54 UTC, after 2 days of trending.
#13 on Hacker News · Front page, on Nov 10, 05:54 UTC. Trendoday checks this list every 15 minutes.
It was first seen on Nov 9, 2026 and has been on the list on 2 days (77 checks) since.
127 points and 68 comments; submitted by sshah03 on Nov 9, 2026.